Composition of the abrasive layer
The abrasive layer of the resinoid bonded Diamond Grinding Tool consists of:
- Abrasive grain
Compact grouted seal without pores
- very high removal rate based on low bond hardness
- Short grinding time
- Low heat development (cool cut)
Resinoid bonded Diamond & CBN Grinding Tools are used in tool grinding (dry and wet)
Hart metal (with Diamond) or tool-steel (CBN) requires a wear resistant grain with low heat generation.
Reasonable use from 1,0 mm diameter.
Grain concentration: C 50 – C 150
Recommanded grain size: D/B 7 – D/B 252